workshop presentations

This page presents Workshop or Conference papers which is not a official terminal publication (i.e. on-going research).

2023

NeurIPSW

Learning to scale logits for temperature-conditional GFlowNets

Minsu Kim, Joohwan Ko, Dinghuai Zhang, Ling Pan, Taeyoung Yun, Woochang Kim, Jinkyoo Park, and Yoshua Bengio

NeurIPS, Workshop Track (AI4Science) 2023
NeurIPSW

Rl4co: an extensive reinforcement learning for combinatorial optimization benchmark

Federico Berto, Chuanbo Hua, Junyoung Park, Minsu Kim, Hyeonah Kim, Jiwoo Son, Haeyeon Kim, Joungho Kim, and Jinkyoo Park

NeurIPS, Oral paper in Workshop track (New Frontiers in Graph Learning) 2023
ICMLW

Bootstrapped Training of Score-Conditioned Generator for Offline Design of Biological Sequences

Minsu Kim, Federico Berto, Sungsoo Ahn, and Park Jinkyoo

In ICML workshop on SPIGM 2023
ICMLW

Solving NP-hard Min-max Routing Problems as Sequential Generation with Equity Context

Jiwoo Son*, Minsu Kim*, Sanghyeok Choi, Hyeonah Kim, and Park Jinkyoo

In ICML workshop on SODS 2023
ICMLW

Symmetric Exploration in Combinatorial Optimization is Free!

Hyeonah Kim, Minsu Kim, Sungsoo Ahn, and Park Jinkyoo

In ICML workshop on SODS 2023

2022

NeurIPSW

Scale-conditioned Adaptation for Large Scale Combinatorial Optimization

Minsu Kim*, Jiwoo Son*, Hyeonah Kim, and Park Jinkyoo

In NeurIPS Workshop on Distributional Shift 2022
NeurIPSW

Collaborative Symmetricity Exploitation for Offline Learning of Hardware Design Solver

Haeyeon Kim*, Minsu Kim*, Joungho Kim, and Park Jinkyoo

In NeurIPS Workshop on Offline RL 2022
NeurIPSW

Neural Coarsening Process for Multi-level Graph Combinatorial Optimization

Hyeonah Kim, Minsu Kim, Changhyun Kwon, and Jinkyoo Park

In NeurIPS Workshop on Graph Learning 2022

2021

IEEE Conference

Sequential Policy Network-based Optimal Passive Equalizer Design for an Arbitrary Channel of High Bandwidth Memory using Advantage Actor Critic

Seonguk Choi, Minsu Kim, Hyunwook Park, Keeyoung Son, Seongguk Kim, Jihun Kim, Joonsang Park, Haeyeon Kim, Taein Shin, Keunwoo Kim, and Joungho Kim

In 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2021

@inproceedings{9609193,
  author = {Choi, Seonguk and Kim, Minsu and Park, Hyunwook and Son, Keeyoung and Kim, Seongguk and Kim, Jihun and Park, Joonsang and Kim, Haeyeon and Shin, Taein and Kim, Keunwoo and Kim, Joungho},
  booktitle = {2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},
  title = {Sequential Policy Network-based Optimal Passive Equalizer Design for an Arbitrary Channel of High Bandwidth Memory using Advantage Actor Critic},
  year = {2021},
  volume = {},
  number = {},
  pages = {1-3},
  doi = {10.1109/EPEPS51341.2021.9609193}
}

IEEE Conference

Signal Integrity Analysis of High Speed Channel considering Thermal Distribution

Keeyoung Son, Seongguk Kim, Minsu Kim, Daehwan Lho, Keunwoo Kim, Hyunwook Park, Gapyeol Park, and Joungho Kim

In 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2021

@inproceedings{9609215,
  author = {Son, Keeyoung and Kim, Seongguk and Kim, Minsu and Lho, Daehwan and Kim, Keunwoo and Park, Hyunwook and Park, Gapyeol and Kim, Joungho},
  booktitle = {2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},
  title = {Signal Integrity Analysis of High Speed Channel considering Thermal Distribution},
  year = {2021},
  volume = {},
  number = {},
  pages = {1-3},
  doi = {10.1109/EPEPS51341.2021.9609215}
}

IEEE Conference

Deep Reinforcement Learning Framework for Optimal Decoupling Capacitor Placement on General PDN with an Arbitrary Probing Port

Haeyeon Kim, Hyunwook Park, Minsu Kim, Seonguk Choi, Jihun Kim, Joonsang Park, Seongguk Kim, Subin Kim, and Joungho Kim

In 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2021

@inproceedings{9609194,
  author = {Kim, Haeyeon and Park, Hyunwook and Kim, Minsu and Choi, Seonguk and Kim, Jihun and Park, Joonsang and Kim, Seongguk and Kim, Subin and Kim, Joungho},
  booktitle = {2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},
  title = {Deep Reinforcement Learning Framework for Optimal Decoupling Capacitor Placement on General PDN with an Arbitrary Probing Port},
  year = {2021},
  volume = {},
  number = {},
  pages = {1-3},
  doi = {10.1109/EPEPS51341.2021.9609194}
}

IEEE Conference

Crosstalk-included PAM-4 Worst Eye Diagram Estimation Method for High-speed Serial Links

Hyunwook Park, Jihun Kim, Minsu Kim, Keunwoo Kim, Boogyo Sim, Daehwan Lho, Taein Shin, Keeyoung Son, Jinwook Song, Youngmin Ku, Jonggyu Park, and Joungho Kim

In 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2021

@inproceedings{9609114,
  author = {Park, Hyunwook and Kim, Jihun and Kim, Minsu and Kim, Keunwoo and Sim, Boogyo and Lho, Daehwan and Shin, Taein and Son, Keeyoung and Song, Jinwook and Ku, Youngmin and Park, Jonggyu and Kim, Joungho},
  booktitle = {2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},
  title = {Crosstalk-included PAM-4 Worst Eye Diagram Estimation Method for High-speed Serial Links},
  year = {2021},
  volume = {},
  number = {},
  pages = {1-3},
  doi = {10.1109/EPEPS51341.2021.9609114}
}

IEEE Conference

Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation

Joonsang Park, Minsu Kim, Seongguk Kim, Keeyoung Son, Taein Shin, Hyunwook Park, Jihun Kim, Seonguk Choi, Haeyeon Kim, Keunwoo Kim, and Joungho Kim

In 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2021

@inproceedings{9609139,
  author = {Park, Joonsang and Kim, Minsu and Kim, Seongguk and Son, Keeyoung and Shin, Taein and Park, Hyunwook and Kim, Jihun and Choi, Seonguk and Kim, Haeyeon and Kim, Keunwoo and Kim, Joungho},
  booktitle = {2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},
  title = {Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation},
  year = {2021},
  volume = {},
  number = {},
  pages = {1-3},
  doi = {10.1109/EPEPS51341.2021.9609139}
}

IEEE Conference

PAM-4 based PCIe 6.0 Channel Design Optimization Method using Bayesian Optimization

Jihun Kim, Hyunwook Park, Minsu Kim, Seongguk Kim, Seonguk Choi, Keeyoung Son, Joonsang Park, Haeyeon Kim, Jinwook Song, Youngmin Ku, Jonggyu Park, and Joungho Kim

In 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2021

@inproceedings{9609213,
  author = {Kim, Jihun and Park, Hyunwook and Kim, Minsu and Kim, Seongguk and Choi, Seonguk and Son, Keeyoung and Park, Joonsang and Kim, Haeyeon and Song, Jinwook and Ku, Youngmin and Park, Jonggyu and Kim, Joungho},
  booktitle = {2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},
  title = {PAM-4 based PCIe 6.0 Channel Design Optimization Method using Bayesian Optimization},
  year = {2021},
  volume = {},
  number = {},
  pages = {1-3},
  doi = {10.1109/EPEPS51341.2021.9609213}
}

IEEE Conference

Imitation Learning for Simultaneous Escape Routing

Minsu Kim, Hyunwook Park, Keeyoung Son, Seongguk Kim, Haeyeon Kim, Jihun Kim, Jinwook Song, Youngmin Ku, Jounggyu Park, and Joungho Kim

In 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2021

@inproceedings{9609145,
  author = {Kim, Minsu and Park, Hyunwook and Son, Keeyoung and Kim, Seongguk and Kim, Haeyeon and Kim, Jihun and Song, Jinwook and Ku, Youngmin and Park, Jounggyu and Kim, Joungho},
  booktitle = {2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},
  title = {Imitation Learning for Simultaneous Escape Routing},
  year = {2021},
  volume = {},
  number = {},
  pages = {1-3},
  doi = {10.1109/EPEPS51341.2021.9609145}
}

2020

IEEE Conference

Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network

Hyunwook Park, Minsu Kim, Subin Kim, Seungtaek Jeong, Seongguk Kim, Hyungmin Kang, Keunwoo Kim, Keeyoung Son, Gapyeol Park, Kyungjune Son, Taein Shin, and Joungho Kim

In 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) 2020

@inproceedings{9312908,
  author = {Park, Hyunwook and Kim, Minsu and Kim, Subin and Jeong, Seungtaek and Kim, Seongguk and Kang, Hyungmin and Kim, Keunwoo and Son, Keeyoung and Park, Gapyeol and Son, Kyungjune and Shin, Taein and Kim, Joungho},
  booktitle = {2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)},
  title = {Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network},
  year = {2020},
  volume = {},
  number = {},
  pages = {1-3},
  doi = {10.1109/EDAPS50281.2020.9312908}
}

IEEE Conference

Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs

Keeyoung Son, Subin Kim, Shinyoung Park, Hyunwook Park, Keunwoo Kim, Taein Shin, Minsu Kim, Kyungjune Son, Gapyeol Park, Seungtaek Jeong, and Joungho Kim

In 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) 2020

@inproceedings{9312897,
  author = {Son, Keeyoung and Kim, Subin and Park, Shinyoung and Park, Hyunwook and Kim, Keunwoo and Shin, Taein and Kim, Minsu and Son, Kyungjune and Park, Gapyeol and Jeong, Seungtaek and Kim, Joungho},
  booktitle = {2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)},
  title = {Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs},
  year = {2020},
  volume = {},
  number = {},
  pages = {1-3},
  doi = {10.1109/EDAPS50281.2020.9312897}
}

IEEE Conference

Reinforcement Learning-based Auto-router considering Signal Integrity

Minsu Kim, Hyunwook Park, Seongguk Kim, Keeyoung Son, Subin Kim, Kyunjune Son, Seonguk Choi, Gapyeol Park, and Joungho Kim

In 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2020

@inproceedings{9231473,
  author = {Kim, Minsu and Park, Hyunwook and Kim, Seongguk and Son, Keeyoung and Kim, Subin and Son, Kyunjune and Choi, Seonguk and Park, Gapyeol and Kim, Joungho},
  booktitle = {2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},
  title = {Reinforcement Learning-based Auto-router considering Signal Integrity},
  year = {2020},
  volume = {},
  number = {},
  pages = {1-3},
  doi = {10.1109/EPEPS48591.2020.9231473}
}

IEEE Conference

Deep Neural Network-based Lumped Circuit Modeling using Impedance Curve

Daehwan Lho, Hyunwook Park, Seongguk Kim, Taein Shin, Keunwoo Kim, Kyungjune Son, Hyungmin Kang, Boogyo Sim, Keeyoung Son, Minsu Kim, and Joungho Kim

In 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) 2020

@inproceedings{9312895,
  author = {Lho, Daehwan and Park, Hyunwook and Kim, Seongguk and Shin, Taein and Kim, Keunwoo and Son, Kyungjune and Kang, Hyungmin and Sim, Boogyo and Son, Keeyoung and Kim, Minsu and Kim, Joungho},
  booktitle = {2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)},
  title = {Deep Neural Network-based Lumped Circuit Modeling using Impedance Curve},
  year = {2020},
  volume = {},
  number = {},
  pages = {1-3},
  doi = {10.1109/EDAPS50281.2020.9312895}
}